Apple iPhone XS and XS Max teardown reveals Intel, Toshiba components

The latest iPhones also had DRAM and NAND memory chips from Micron Technology.

from Latest News India on Firstpost https://ift.tt/2O2kHMH
Reuters

Comments

Popular posts from this blog

Both COVID-19 vaccine doses needed for good protection against B16172 variant

New coronavirus variant emerge in India: How should our COVID response change?

NABCONS invites applications for 22 senior and junior consultant posts; apply at nabcons.com